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50-3170
Thermally Conductive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
EPO-TEK® HYB-353ND-LV
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
50-3112
Thermally Conductive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
20-2175
Potting & Encapsulating
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
50-2369FR
Thermally Conductive
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
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