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EPO-TEK® OE121
Underfill Epoxy
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EP-CLEARSEAL
100% solids, interior and exterior, high-gloss epoxy sealer
EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.
CONVERGENT Pentra-Cure® (MH)
All-In-One Cure, Hardener and Densifier
Pentra-Cure™ (MH) is an eco-friendly, all-in-one treatment that cures, hardens and densifies fresh concrete with one application. It provides long-term protection for commercial and industrial floors against heavy wear and abuse. This unique solution forms a membrane on...
20-3060
Potting & Encapsulating
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPX50LT-OVERLAY
Cold weather, low modulus, epoxy urethane co-polymer
EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.
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