EPO-TEK® T606-3 - Thermally Conductive Epoxy

All purpose thixotropic and room temperature-curing epoxy adhesive.

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...

Pentra-Clean™ (DC) Daily Cleaner easily removes stains, dirt, grease and grime from concrete, terrazzo, natural stone and tile floor surfaces. This product is easy to use, leaves no film or residue and has a neutral pH with no...

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.