Overview
Our thermally conductive epoxies provide advanced solutions for managing heat in high-power electronics, automotive, aerospace, and medical applications. These adhesives combine thermal conductivity with electrical insulation, making them ideal for semiconductor packaging, heat-sinking, and potting applications. With a wide range of formulations, including high-temperature and chemical-resistant options, EPO-TEK®’s thermally conductive adhesives deliver reliable performance under extreme conditions. Our products are used in microelectronics and hermetic packaging, ensuring optimal thermal management while maintaining structural integrity in demanding environments.
Products
EPO-TEK® 930-4
Thermally Conductive Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® H67-MP
Thermally Conductive Adhesive
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.