Electronics

Overview

Our thermally conductive epoxies provide advanced solutions for managing heat in high-power electronics, automotive, aerospace, and medical applications. These adhesives combine thermal conductivity with electrical insulation, making them ideal for semiconductor packaging, heat-sinking, and potting applications. With a wide range of formulations, including high-temperature and chemical-resistant options, EPO-TEK®’s thermally conductive adhesives deliver reliable performance under extreme conditions. Our products are used in microelectronics and hermetic packaging, ensuring optimal thermal management while maintaining structural integrity in demanding environments.

Products

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EPO-TEK® 930-4

EPO-TEK® 930-4

Thermally Conductive Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

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EPO-TEK® H67-MP

EPO-TEK® H67-MP

Thermally Conductive Adhesive

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

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EPO-TEK® H70E

EPO-TEK® H70E

Thermally Conductive Adhesive

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

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