EPO-TEK® 930-4 - Thermally Conductive Adhesive

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).