EPO-TEK® 930-4

Features

Ease of use: long pot-life with low temperature cure of 80°C possible.
Formulated with a very fine boron-nitride filler particle
Passes NASA low outgassing standard ASTM E595 with proper cure

Applications

Recommended for applications where heat dissipation and insulating properties are essential; attaching heat sinks on PCB; heat-sinking in hybrids such as DIP or TO-cans; kovar, aluminum or ceramic packaging.
Semiconductor applications: die-attach inside plastic IC packages using JEDEC format; die bonding power devices; thermally conductive underfill and glob top for flip-chip assembled die.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 930-4 TDS

File Size 576.3 KB

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Safety Data Sheet

Document Name EPO-TEK® 930-4 SDS

File Size 637.7 KB

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Safety Data Sheet

Document Name EPO-TEK® 930-4 Syringe SDS

File Size 431.5 KB

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Safety Data Sheet

Document Name EPO-TEK® 930-4 Syringe SDS 2026 GHS Update

File Size 505.1 KB

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Safety Data Sheet

Document Name EPO-TEK® 930-4 SDS 2026 GHS Update

File Size 667.9 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom E-mobility Microelectronics/Semiconductors Off-shore Drilling

Market:

Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding High Temperature Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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