Features
- Complies with the requirements of MIL-STD 883/Method 5011
- Yields low levels of water extractable ions such as chlorides
- Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage
- Available in different viscosity ranges
Applications
- Widely used epoxy; popular choice for non-silver-filled die-attach epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT
- Die-attach for small chips such as GaAs, LEDs and diodes, as well as SMDs
- Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames
Certifications
- MIL-STD 883/5011
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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