EPO-TEK® H67-MP

Features

Complies with the requirements of MIL-STD 883/Method 5011
Yields low levels of water extractable ions such as chlorides
Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage
Available in different viscosity ranges

Applications

Widely used epoxy; popular choice for non-silver-filled die-attach epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT
Die-attach for small chips such as GaAs, LEDs and diodes, as well as SMDs
Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H67-MP TDS

File Size 559.6 KB

View

Safety Data Sheet

Document Name EPO-TEK® H67-MP SDS

File Size 338.3 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Microelectronics/Semiconductors

Market:

Aerospace and Defense Electronics

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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