EPO-TEK® H70E

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.