Overview
Our UV and UV Hybrid Epoxy line delivers fast, photocurable adhesives ideal for applications in electronics, medical devices, and photonics. These single-component systems simplify processing with quick UV curing and an unlimited pot life, offering efficient bonding for fiber optics, lenses, and PCBs. UV hybrids add versatility with their two-step process—UV tack for immediate positioning, followed by thermal curing for high-reliability bonds. EPO-TEK®’s UV adhesives support rapid throughput while maintaining robust adhesion, ideal for industries requiring precise alignment and high-performance materials such as active alignment in LiDAR.
Products
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EPO-TEK® HYB-353ND-HV
UV Hybrid
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEK® HYB-353ND-LV
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEK® HYB-353ND-TX2
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® OG116-31
UV Curable Epoxy
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
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