EPO-TEK® HYB-353ND - UV Hybrid

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.