EPO-TEK® HYB-353ND-TX2 - UV Hybrid Epoxy

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

ASI 502 100% RTV Silicone is a one-component, moisture cure, acetoxy silicone that cures to form an extremely durable rubber that can withstand a variety of extreme environments.Unlike many organic sealants, ASI 502 is extremely resistant to degradation,...

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...