EPO-TEK® HYB-353ND-LV - UV Hybrid

Epo Tek Hyb 353nd Tx2 Main Product Image 1368x874px

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of EPO-TEK® HYB-353ND. 

SDS TDS
Brand:
Epoxy Technology
Technology:
Epoxy
Application:
Datacom and Telecom E-mobility Optical Sensors and Camera Modules
Market:
Automotive and Transportation Optical, Datacom and Telecom
Function:
Bonding Encapsulation Sealing

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:
EPO-TEK® H20E-HC

EPO-TEK® H20E-HC

Electrically & Thermally Conductive Epoxy

High thermal conductivity version of EPO-TEK® H20E.

TDS
View product
EPO-TEK® H37-MP

EPO-TEK® H37-MP

Electrically & Thermally Conductive Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

View product
20-3305

20-3305

Potting & Encapsulating

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

SDS
TDS
View product
EPO-TEK® TZ101

EPO-TEK® TZ101

Thermally Conductive Adhesive

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

SDS TDS
View product
EPO-TEK® 343ND-LH

EPO-TEK® 343ND-LH

Optical Grade Epoxy

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

SDS
TDS
View product
EPO-TEK® OG142-87

EPO-TEK® OG142-87

UV Curable Epoxy

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

SDS
TDS
View product

Get in touch to learn more

Speak to us on 1-978-667-3805

Contact us