Features
- Active alignment for lens optics, diodes and components
- UV tacking for precision alignment
- Very low viscosity
Applications
- Fiber Optics: Fiber bonding and component alignment
- Optoelectronics: Optical components sub-assemblies, lens, optics, diodes, and component bonding
- Piezo electric bonding
- LiDAR and IR sensors
Certifications
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Notes
Related Products

EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.

50-3150RFRBK
Electrically Insulating Epoxy
UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
50-3150RFRBK
Electrically Insulating Epoxy
UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid EpoxyLet's talk
We're here to help you create the perfect product.

















