Microelectronics/Semiconductor

Overview

Our EPO-TEK^® microelectronics and semiconductor adhesives are engineered for critical applications, offering exceptional thermal conductivity, electrical insulation, optical properties and reliable adhesion.

Our HI-REL die attach adhesives used with hybrid microelectronics and semiconductor packaging technologies provide the highest reliability possible. These solutions boast high temperature resistance, low outgassing, very high degradation temperature, and are compatible with industry standard robotic and placement machines for high yield, high accuracy assembly, ionically clean and pure, low bleed-out and high strength on Au, whether on ceramic substrates, SMD or diode contact pads.