Related Products
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

CONVERGENT Pentra-Sil® (IH)
Stone and Concrete Hardener
Pentra-Sil® (IH) is specifically designed for application during the concrete polishing process. This penetrating hardener improves the final appearance by allowing abrasive tooling to work more effectively, increasing final gloss and clarity. It reduces downtime between polishing steps,...

XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

CONVERGENT STRiON:FORTIFY
Spray On Concrete Densifier
STRiON:Fortify is a revolutionary new method of concrete densification and hardening. Using groundbreaking new silica-free technology, STRiON relies on an ionic transfer process to disperse deep into concrete to make it more resilient, resistant to traffic, dustproof, easy...
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
CONVERGENT Pentra-Sil® (IH)
Stone and Concrete Hardener
Pentra-Sil® (IH) is specifically designed for application during the concrete polishing process. This penetrating hardener improves the final appearance by allowing abrasive tooling to work more effectively, increasing final gloss and clarity. It reduces downtime between polishing steps,...
XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.
CONVERGENT STRiON:FORTIFY
Spray On Concrete Densifier
STRiON:Fortify is a revolutionary new method of concrete densification and hardening. Using groundbreaking new silica-free technology, STRiON relies on an ionic transfer process to disperse deep into concrete to make it more resilient, resistant to traffic, dustproof, easy...


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