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EPO-TEK® H67-MP
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Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
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Water-Based Pad Adhesive
722 is designed to quickly lock carpet pad into place. This easy-to-use synthetic latex and hydrocarbon resin blend is non-flammable, solvent-free, fast-grabbing, and prevents slippage during power-stretching with its immediate wet-suction.
EPO-TEK® H35-175MP
Electrically & Thermally Conductive Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H70E
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Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
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Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
EP-CLEARSEAL
100% solids, interior and exterior, high-gloss epoxy sealer
EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.
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