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20-2362FR
Potting & Encapsulating
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

DP 99
SPRAY DEGALVANIZER
DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...

Dynamic
Firm-Set, Modified Transitional Pressure Sensitive Adhesive
When it comes to ultimate adaptability for numerous flooring types, Dynamic holds the market. Breaking all the rules, this revolutionary product saves time with its instant access for light traffic. Dynamic provides the superior bond-strength of a fully...

EPO-TEK® T7109
Thermally Conductive Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

EPO-TEK® HYB-353ND
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A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

DP 1010
WATER BASED DUCT SEALANT
A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....
20-2362FR
Potting & Encapsulating
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
DP 99
SPRAY DEGALVANIZER
DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...
Dynamic
Firm-Set, Modified Transitional Pressure Sensitive Adhesive
When it comes to ultimate adaptability for numerous flooring types, Dynamic holds the market. Breaking all the rules, this revolutionary product saves time with its instant access for light traffic. Dynamic provides the superior bond-strength of a fully...
EPO-TEK® T7109
Thermally Conductive Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.


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