Downloads
Technical Data Sheet
Certifications
Related Products
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
ASI 55
Multi-Purpose Hybrid Sealant and Adhesive
ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...
EPC-OVERLAY
Epoxy Polymer Concrete Overlay
EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
CRACKBOND® CSR
Low Viscosity Adhesive
2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.
EP-CLEARSEAL
High Gloss Clear Epoxy Sealant
EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.
Get in touch to learn more
Speak to us on 401-946-5564
Contact us