EPO-TEK® H20E-HC

Higher-performance, low-modulus, epoxy patching mortar.

Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy. 

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications. 

U-5 is a superior one component moisture curing urethane adhesive. U-5 offers good wet / green grab, superior non-slump capability, and excellent shrink resistance allowing consistent contact between the wood flooring and substrate. U-5 has high strength bond...