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CONVERGENT Pentra-Cure® (MH)
Concrete Cure, Hardener and Densifer
Pentra-Cure™ (MH) is an eco-friendly, all-in-one treatment that cures, hardens and densifies fresh concrete with one application. It provides long-term protection for commercial and industrial floors against heavy wear and abuse. This unique solution forms a membrane on...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EP-CLEARSEAL
High Gloss Clear Epoxy Sealant
EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
EP-PATCH 7040
High-performance, low-modulus, epoxy patching mortar
EP-PATCH 7040 is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. This low-modulus material offers excellent bond strength and outstanding workability, providing extended working times for higher temperature applications. The EP-PATCH 7040 system combines a high-quality epoxy resin and curing agent...
ULTRABOND® ACRYL-8CC
Fast Cure Anchoring Adhesive
For use in cracked and uncracked normal weight and lightweight concrete, ULTRABOND ACRYL-8CC has a full cure rate of 45 minutes at 70° F (21° C) and an 18-month shelf life. With an extended in-service temperature range of...
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