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EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.

ASI 306
Electronic Grade Self-Leveling Silicone
ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

CRACKBOND® CSR
Low Viscosity Adhesive
2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
ASI 306
Electronic Grade Self-Leveling Silicone
ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
CRACKBOND® CSR
Low Viscosity Adhesive
2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.


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