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EPO-TEK® HYB-353ND-HV
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A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
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CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...
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DP 88 is an aerosol spray edge coating or “duct butter” formulated to quickly and conveniently coat cut or damaged insulation.DP 88 combines the advantages of quick drying aerosol adhesives with the tack-free and flexible properties of sealants...
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Pentra-Sil® (IH) is specifically designed for application during the concrete polishing process. This penetrating hardener improves the final appearance by allowing abrasive tooling to work more effectively, increasing final gloss and clarity. It reduces downtime between polishing steps,...
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Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
EPO-TEK® OE121 Black
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Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
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