EPO-TEK® 377H - Graphite Filled Bonding Epoxy

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...