Related Products

EP100-SEAL HM
Two Component Epoxy Penetrating Sealer
EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.

50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.

Alpine™
Moisture-Cured Urethane Adhesive
Alpine is designed to protect flooring from substrate moisture without requiring any moisture or pH testing. It can easily install several flooring types including: solid (shorts) and engineered wood, parquet, and bamboo (not strand woven). This one-part, moisture-cured...

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EP100-SEAL HM
Two Component Epoxy Penetrating Sealer
EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.
50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
EP-GEL FAST
Non-sag, high-modulus, high-strength doweling gel
EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.
Alpine™
Moisture-Cured Urethane Adhesive
Alpine is designed to protect flooring from substrate moisture without requiring any moisture or pH testing. It can easily install several flooring types including: solid (shorts) and engineered wood, parquet, and bamboo (not strand woven). This one-part, moisture-cured...
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.


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