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EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
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Thermally Conductive
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
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UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...
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Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
EPO-TEK® 353ND
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High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
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Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
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