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EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
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Water Resistant Adhesive
Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.
EPC-OVERLAY
Epoxy Polymer Concrete Overlay
EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...
EPO-TEK® HYB-353ND-HV
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A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
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Thixotropic Polyurethane Encapsulant
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
ASI 6900
Quick Grab Adhesive for Heavy Duty Applications
ASI 6900 Extreme Fast-Grab Hybrid Adhesive grabs and holds substrates within just a few seconds, making it ideal for holding heavy objects in place while adhesive cures to form a long-term, durable bond. This reduces or eliminates the...
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