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EP-CLEARSEAL
High Gloss Clear Epoxy Sealant
EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.

CONVERGENT Pentra-Finish™ (HG)
High Gloss Lithium Concrete Sealer
Pentra-Finish™ (HG) is an advanced, high-gloss, fast-drying lithium sealer that creates a microfilm on polished concrete, stone, terrazzo, masonry and other cementitious surfaces. This easy-to-use finish increases shine, enhances color and improves resistance against abrasion and stains. Pentra-Finish™...

EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

EPO-TEK® H37-MP
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Low stress and low temperature cure temperature version of H35-175MP.

EPO-TEK® MED-HYB-353ND
Medical Grade UV Hybrid Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.
EP-CLEARSEAL
High Gloss Clear Epoxy Sealant
EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.
CONVERGENT Pentra-Finish™ (HG)
High Gloss Lithium Concrete Sealer
Pentra-Finish™ (HG) is an advanced, high-gloss, fast-drying lithium sealer that creates a microfilm on polished concrete, stone, terrazzo, masonry and other cementitious surfaces. This easy-to-use finish increases shine, enhances color and improves resistance against abrasion and stains. Pentra-Finish™...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® MED-HYB-353ND
Medical Grade UV Hybrid Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.


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