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EPX50LT-OVERLAY
Epoxy Urethane Polymer Resin
EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.
DP 40
Butyl Joint Sealant
A skinning, permanently flexible butyl joint sealant that is ideal for low and high temperature insulation applications. DP 40 is recommended to seal joints in cellular foam glass and remains flexible to -70° F. DP 40 acts as...
HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
ULTRABOND® 2
Ultrabond Epoxy
With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
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