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Seal&Shine Finish is the final step in the SlabArmor™ system, intended to be applied after the placement and finishing process. This high-performance, high-gloss finish, seals, protects and extends the life of your SlabArmor™ floor, eliminating the need for...

CONVERGENT SlabArmor™ Starter
Colloidal Silica Concrete Curing/Finishing Aid and Hardener
SlabArmor™ Starter is a colloidal silica concrete curing/finishing aid and hardener used in the placement and finishing of new concrete. Its hydrophilic property holds bleed water in the capillaries of the concrete slab during the curing process, reducing...

PILE ANCHOR GROUT
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Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® HYB-353ND-HV
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CONVERGENT SlabArmor™ Seal&Shine Finish
High-Performance, High-Gloss Concrete Finisher and Sealer
Seal&Shine Finish is the final step in the SlabArmor™ system, intended to be applied after the placement and finishing process. This high-performance, high-gloss finish, seals, protects and extends the life of your SlabArmor™ floor, eliminating the need for...
CONVERGENT SlabArmor™ Starter
Colloidal Silica Concrete Curing/Finishing Aid and Hardener
SlabArmor™ Starter is a colloidal silica concrete curing/finishing aid and hardener used in the placement and finishing of new concrete. Its hydrophilic property holds bleed water in the capillaries of the concrete slab during the curing process, reducing...
PILE ANCHOR GROUT
Fast-strength, fast-setting epoxy anchoring grout
PILE ANCHOR GROUT is a two-component, 100% solids, high strength, pourable epoxy anchoring grout.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...


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