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CONVERGENT Pentra-Sil® (C&N)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (C&N) cleans and neutralizes concrete floors that suffer from surface sweating and efflorescence. This treatment stabilizes the alkalinity in concrete surfaces by infusing lithium ions throughout the substrate.

EP100-SEAL HM
Two Component Epoxy Penetrating Sealer
EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.

Enhance®
Cutback Adhesive Encapsulator and Bond Promoter
Take your job site to the next level with Enhance. Its multi-functioning capabilities tackle many tough challenges such as detackifying or encapsulating existing adhesive residue, including cutback. Even difficult-to-bond substrates are no match for the textured surface profile...

60-7185RCL
UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
CONVERGENT Pentra-Sil® (C&N)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (C&N) cleans and neutralizes concrete floors that suffer from surface sweating and efflorescence. This treatment stabilizes the alkalinity in concrete surfaces by infusing lithium ions throughout the substrate.
EP100-SEAL HM
Two Component Epoxy Penetrating Sealer
EP100-SEAL HM is a highly penetrating, two-component epoxy healer/sealer.
Enhance®
Cutback Adhesive Encapsulator and Bond Promoter
Take your job site to the next level with Enhance. Its multi-functioning capabilities tackle many tough challenges such as detackifying or encapsulating existing adhesive residue, including cutback. Even difficult-to-bond substrates are no match for the textured surface profile...
60-7185RCL
UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...


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