EPO-TEK® TZ101 Thermally Conductive Epoxy

Features

Excellent damp heat resistance, via 85°C/85%RH
Excellent combination of stress relief and robustness

Applications

Electronics: Bonding to Kapton flex PCB circuits, Adhesive for LCP packaging
Semiconductor: Large IC die attach > 500 mil x 500 mil Si chips, can be used as an underfill for flip chip mounted ICs, BGAs, and SMDs
Opto-electronics: Heat sinking laser diode chips in ceramic, hybrid or TO-can packaging and bonding to thermally enhanced substrates such as aluminum nitride, Cu/W or Cuplated BeO. White color after cure makes it attractive for LED, opto-coupler and x-ray scintillator circuits

Downloads

Type

Document Name

File Size

Safety Data Sheet

Document Name EPO-TEK® TZ101 SDS

File Size 173.8 KB

View

Technical Data Sheet

Document Name EPO-TEK® TZ101 TDS

File Size 136.7 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Microelectronics/Semiconductors Optical Sensors and Camera Modules

Market:

Electronics Optical, Datacom and Telecom

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

20-2362FR

Fire Retardant Urethane

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

TDS

50-3150RFRBK

Electrically Insulating Epoxy

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

TDS

10-2080

Polyurethane Adhesive

10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

TDS

EPO-TEK® H35-175MP

Low Outgassing Silver Epoxy

Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

SDS TDS

EPO-TEK® 343ND-LH

Optical Epoxy Adhesive

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

TDS

ASI 505

Industrial Grade Silicone Self Leveling

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

SDS TDS