Features
- Excellent damp heat resistance, via 85°C/85%RH
- Excellent combination of stress relief and robustness
Applications
- Electronics: Bonding to Kapton flex PCB circuits, Adhesive for LCP packaging
- Semiconductor: Large IC die attach > 500 mil x 500 mil Si chips, can be used as an underfill for flip chip mounted ICs, BGAs, and SMDs
- Opto-electronics: Heat sinking laser diode chips in ceramic, hybrid or TO-can packaging and bonding to thermally enhanced substrates such as aluminum nitride, Cu/W or Cuplated BeO. White color after cure makes it attractive for LED, opto-coupler and x-ray scintillator circuits
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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Speak to us on 1-978-667-3805
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