EPO-TEK® TZ101 Thermally Conductive Epoxy

Features

Excellent damp heat resistance, via 85°C/85%RH
Excellent combination of stress relief and robustness

Applications

Electronics: Bonding to Kapton flex PCB circuits, Adhesive for LCP packaging
Semiconductor: Large IC die attach > 500 mil x 500 mil Si chips, can be used as an underfill for flip chip mounted ICs, BGAs, and SMDs
Opto-electronics: Heat sinking laser diode chips in ceramic, hybrid or TO-can packaging and bonding to thermally enhanced substrates such as aluminum nitride, Cu/W or Cuplated BeO. White color after cure makes it attractive for LED, opto-coupler and x-ray scintillator circuits

Downloads

Type

Document Name

File Size

Safety Data Sheet

Document Name EPO-TEK® TZ101 SDS

File Size 173.8 KB

View

Technical Data Sheet

Document Name EPO-TEK® TZ101 TDS

File Size 136.7 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Microelectronics/Semiconductors Optical Sensors and Camera Modules

Market:

Electronics Optical, Datacom and Telecom

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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