Features
- 100% solid silver filled epoxy with smooth thixotropic consistency (Thixotropic 3.5)
- Thermal conductivity of 23 W/mK at recommended curing schedule
- Versatile in processing and curing methods
Applications
- Concentrator PV solar cell chip attach
- Thermal epoxy
- LED die attach
Certifications

Available Packaging
Notes
Contact our customer service or sales representative for more information.
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