EPO-TEK® H35-175MP - Low Outgassing Silver Epoxy

Hot Melt Adhesives

Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.

CRACKBOND® V200 HI-MOD

Low Viscosity Epoxy Sealer

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

CRACKBOND® INDUSTRIAL CITRUS CLEANER

Industrial Citrus Cleaner for Epoxy Removal

CRACKBOND® INDUSTRIAL CITRUS CLEANER is bio-renewable, organic, and safe-to-use solvent ideal for removing uncured epoxies from tools and equipment. It also performs exceptionally well as a heavy-duty stripper and degreaser, and can be used for general cleaning of...

EP-SLV

Low Viscosity Exposy Adhesive

EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...

60-7185RCL

UV Curable Urethane Acrylate

Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.

EPO-TEK® OE121 Black

Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...