Features
- ≥ 100⁰C glass transition temperature
- Smooth thixotropic paste ( 22,000-28,000cps, Thixo 4.0)
- ≥ 10kg die shear strength
- MIL-STD 883/5011 and NASA ASTM E595 low outgassing epoxy
Applications
- Optoelectronics packaging
- Hybrid microelectronics
- Semiconductor IC packaging : die attach
- GaAs, LEDs, diodes chip attach
- Military applications
Downloads
Certifications
![RoHS compliant Logo](https://meridianadhesives.com/wp-content/srcsets/app/certification-logo/yyve4lhgqlzkz00bac0xaaypvwyhm66q/rohs-compliant-216-x-216px.jpg/rohs-compliant-216-x-216px.q80w152h152.jpg)
![MIL-STD 883/5011 Logo](https://meridianadhesives.com/wp-content/srcsets/app/certification-logo/tkaf9wcqyz2frlstopzuosv7gwk7mkci/mil-std-883-5011-216-x-216px.jpg/mil-std-883-5011-216-x-216px.q80w152h152.jpg)
- ASTM E595
Available Packaging
Notes
Contact our customer service or sales representative for more information.
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