EPO-TEK® H20E-MP

Features

100% solid silver filled epoxy
Complies with MIL-STD 883/Test method 5011
NASA approved low outgassing adhesive
Excellent thermal management with its high thermal conductivity
Versatile in processing and curing methods
Snap curable

Applications

Semiconductor IC packaging: Si and MEMS chip or die attach
Hybrid microelectronics : quartz crystal oscillators attach, GaAs chip attach
EMI Shielding for RF, Microwave and IR Devices
Electrical Connection for smart cards, RFID tags, speakers/microphones
Solar-Photovoltaic: electrical connection, solar cell stringging adhesives and chip attach
Opto-Electronics: fiber optic components, high power laser circuit, IR detector and LED die attach
Thermal management for heat generate chip or component

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name epotek®

File Size 629.2 KB

View

Safety Data Sheet

Document Name H20E-MP

File Size 541.4 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

Related Products

Viewing options:

EP50-SC

Fast-Setting, Low-Modulus Epoxy Polymer

EP50-SC (Standard Cure) is a moisture-insensitive, 100% solids epoxy polymer engineered for skid-resistant overlay systems and other demanding infrastructure applications. Designed to provide exceptional bond strength, high early strength, and long-term durability, EP50-SC delivers reliable performance on bridge...

SDS TDS

50-3141FR

Flame Retardant Epoxy Adhesive

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

TDS

CRACKBOND® JF-82 FAST

Fast Cure Polyurea Joint Filler

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.

TDS

EPO-TEK® HYB-353ND-TX2

UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

SDS TDS

ASI 5900

Fast Grab Adhesive

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

2590 / 2595 SPRAY GUNS

Adhesive Spray Guns

Spray guns for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters.

Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E-MP - Electrically Conductive Silver Epoxy

Features

Applications

Downloads

Certifications