EPO-TEK® H20E-MP

Features

100% solid silver filled epoxy
Complies with MIL-STD 883/Test method 5011
NASA approved low outgassing adhesive
Excellent thermal management with its high thermal conductivity
Versatile in processing and curing methods
Snap curable

Applications

Semiconductor IC packaging: Si and MEMS chip or die attach
Hybrid microelectronics : quartz crystal oscillators attach, GaAs chip attach
EMI Shielding for RF, Microwave and IR Devices
Electrical Connection for smart cards, RFID tags, speakers/microphones
Solar-Photovoltaic: electrical connection, solar cell stringging adhesives and chip attach
Opto-Electronics: fiber optic components, high power laser circuit, IR detector and LED die attach
Thermal management for heat generate chip or component

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name epotek®

File Size 629.2 KB

View

Safety Data Sheet

Document Name H20E-MP

File Size 541.4 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

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Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E-MP - Electrically Conductive Silver Epoxy

Features

Applications

Downloads

Certifications