EPO-TEK® H37-MP - Low Temperature Cure Epoxy

SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...

CRACKBOND® JF-90 HD is a two component, moisture insensitive heavy duty epoxy joint filler and crack filling material. Its semi-rigid design allows for use in industrial floors exposed to hard-wheeled forklift traffic. It shaves easily and may be...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

C-CLEAN100 is a heavy-duty stripper and degreaser that is used for general cleaning and degreasing of concrete surfaces, tools and equipment.

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.