EPO-TEK® 301-2 - Optically Transparent Epoxy Resin

Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...