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CONVERGENT Pentra-Melt™
Concrete Safe De-Icer
Pentra-Melt™ is a fast-acting de-icer for concrete driveways, sidewalks, ramps, steps, loading docks and decks. This industrial strength formula melts ice on contact as low as -40 ºF (-40 ºC). It works to separate ice from the surface,...

CRACKBOND® LR-321 LV, SLV, TX0
Epoxy Injection for Concrete Cracks
LR-321 crack injection epoxies offer versatility for various high performance structural applications. LR-321 LV (formerly known as LR-321) is a low viscosity epoxy for cracks that range from 1/8 in. to < 1/4 in. LR-321 SLV is a...

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
CONVERGENT Pentra-Melt™
Concrete Safe De-Icer
Pentra-Melt™ is a fast-acting de-icer for concrete driveways, sidewalks, ramps, steps, loading docks and decks. This industrial strength formula melts ice on contact as low as -40 ºF (-40 ºC). It works to separate ice from the surface,...
CRACKBOND® LR-321 LV, SLV, TX0
Epoxy Injection for Concrete Cracks
LR-321 crack injection epoxies offer versatility for various high performance structural applications. LR-321 LV (formerly known as LR-321) is a low viscosity epoxy for cracks that range from 1/8 in. to < 1/4 in. LR-321 SLV is a...
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
SEALANT CHIP BRUSHES
Sealant Chip Brushes
Available in 2" and 3" sizes
60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.


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