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ULTRABOND® HARD-ROK
Concrete Strength Anchoring Adhesive
For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...

60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.

EPO-TEK® MED-314
Biocompatible/ High Temperature Transparent Epoxy
ISO 10993-5 biocompatible, clear, and colorless optical-grade epoxy with low viscosity.

ULTRABOND® HYB-2CC
High Strength Concrete Anchoring Adhesive
For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...

EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

Dextrin Adhesives
Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.
ULTRABOND® HARD-ROK
Concrete Strength Anchoring Adhesive
For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...
60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
EPO-TEK® MED-314
Biocompatible/ High Temperature Transparent Epoxy
ISO 10993-5 biocompatible, clear, and colorless optical-grade epoxy with low viscosity.
ULTRABOND® HYB-2CC
High Strength Concrete Anchoring Adhesive
For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
Dextrin Adhesives
Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.


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