Features
- Low viscosity allows for bubble-free potting and encapsulation.
- Room temperature or low temperature cure (< 100°C) permits use in temperature sensitive devices.
- Low exothermic chemistry during polymerization. This allows up to one liter to be cast or potted in volumes.
Applications
- Semiconductor: capillary flow underfill for flip chip mounted die; possible glob top “fill” encapsulant.
- Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting thermistors into cavities; potting and protection of resistor coils or Peltier devices.
- Hybrids: potting power modules found in electronics such as cockpit, aerospace and Rf/Microwave devices.
- Optical: encapsulation around copper coils found in nuclear and magnetic imaging; heat sinking outdoor LCD / touch panels exposed to sunlight.
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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Speak to us on 1-978-667-3805
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