EPO-TEK® T7110 Thermally Conductive Insulating Epoxy

Features

Low viscosity allows for bubble-free potting and encapsulation.
Room temperature or low temperature cure (< 100°C) permits use in temperature sensitive devices.
Low exothermic chemistry during polymerization. This allows up to one liter to be cast or potted in volumes.

Applications

Semiconductor: capillary flow underfill for flip chip mounted die; possible glob top “fill” encapsulant.
Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting thermistors into cavities; potting and protection of resistor coils or Peltier devices.
Hybrids: potting power modules found in electronics such as cockpit, aerospace and Rf/Microwave devices.
Optical: encapsulation around copper coils found in nuclear and magnetic imaging; heat sinking outdoor LCD / touch panels exposed to sunlight.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® T7110 TDS

File Size 627.1 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7110 SDS

File Size 429.2 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7110 Syringe SDS

File Size 272.0 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA E-mobility Microelectronics/Semiconductors

Market:

Aerospace and Defense Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Glop-Top Potting and Encapsulation Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

50-2369FR

Flame Retardant Potting Urethane

Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

TDS

EPO-TEK® 353NDP

PROPEL FORWARD WITH EPO-TEK® 353NDP

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

SDS TDS

EPO-TEK® H20E

Silver Filled Electrically Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

TDS

20-2362FR

Fire Retardant Urethane

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

TDS

70-3812NC

Aluminum Filled Epoxy

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

TDS

50-3170

Thermally Conductive Epoxy Rubber Repair Adhesive

Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

TDS

Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® T7110 - Thermally Conductive Electrically Insulating Epoxy

Features

Applications

Downloads

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.