Downloads
Technical Data Sheet
Related Products
2590 / 2595 SPRAY GUNS
Adhesive Spray Guns
Spray guns for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters.
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
70-3812NC
Aluminum Filled Epoxy
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
Get in touch to learn more
Speak to us on 401-946-5564
Contact us