EPO-TEK® T7109 Thermal Adhesive Heatsink

Features

Low temperature cure between 80°C and 150°C allows use on lower cost plastics and temperature sensitive devices
Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.
Thixotropic paste allows for application by automatic dispensers or screen printers. It can also be applied by hand or spatula.
Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics including Kapton.

Applications

Semiconductor: Thermally conductive underfill / Electrically non conductive die attach, low stress for large die exceeding 500 mil x 500 mil.
Hybrid Micro-electronics: Large die attach, adhesion to GaAs devices, ceramic substrate attach to housing.
Fiber Optic Packaging: Substrate attach of optical bench; TECooler attach; good adhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diode attach.
Liquid Crystal Displays: die-attach micro-LCDs onto flex circuits like Kapton, or rigid carriers like FR4, ceramic, or silicon.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK®T7109 TDS

File Size 600.5 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7109 SDS

File Size 305.7 KB

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Safety Data Sheet

Document Name EPO-TEK® T7109 Syringe SDS

File Size 227.4 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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