EPO-TEK® T7109 Thermal Adhesive Heatsink

Features

Low temperature cure between 80°C and 150°C allows use on lower cost plastics and temperature sensitive devices
Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.
Thixotropic paste allows for application by automatic dispensers or screen printers. It can also be applied by hand or spatula.
Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics including Kapton.

Applications

Semiconductor: Thermally conductive underfill / Electrically non conductive die attach, low stress for large die exceeding 500 mil x 500 mil.
Hybrid Micro-electronics: Large die attach, adhesion to GaAs devices, ceramic substrate attach to housing.
Fiber Optic Packaging: Substrate attach of optical bench; TECooler attach; good adhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diode attach.
Liquid Crystal Displays: die-attach micro-LCDs onto flex circuits like Kapton, or rigid carriers like FR4, ceramic, or silicon.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK®T7109 TDS

File Size 600.5 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7109 SDS

File Size 305.7 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7109 Syringe SDS

File Size 227.4 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

PILE ANCHOR GROUT

Fast-strength, fast-setting epoxy anchoring grout

PILE ANCHOR GROUT is a two-component, 100% solids, high strength, pourable epoxy anchoring grout.

TDS

CRACKBOND® 2300 GEL

High Strength Gel Bonding Adhesive

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

ASI 504

Multi Purpose RTV Silicone Sealant and Adhesive

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

TDS

DP 2510 – Black / DP 2515 – White

Fiberglass Protective Coating

A UL Classified coating for repairing and encapsulating damaged fiberglass insulation and line set protection from UV degradation. DP 2510/2515 provides a flexible, durable coating which helps to prevent fibers from entering the air stream. It may also...

SDS TDS

EPO-TEK® H67-MP

Thermally Conductive Epoxy

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

SDS TDS

ULTRABOND® 1300

High Strength Anchoring Epoxy

Smooth, non-sag, non-abrasive consistency ideal for use in bulk dispensing systems without adverse wear on pumps. Extensive DOT approvals. Available in cartridges and bulk with ATC.

Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® T7109 - Thermal Heatsink Adhesive

Features

Applications

Downloads

Certifications

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.