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ASI 12SK
Hi-Flex Butyl Sealant
ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...

EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

ULTRABOND® ASF-1000
Fast-Set Doweling Epoxy Adhesive
Fast curing, styrene free, acrylic system. Numerous DOT approvals. Available in 10 oz. and 28 oz. cartridges. Browse our selection of anchoring and doweling adhesives for vertical construction and transportation infrastructure. Learn more about cold weather epoxy and...

EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
ASI 12SK
Hi-Flex Butyl Sealant
ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
ULTRABOND® ASF-1000
Fast-Set Doweling Epoxy Adhesive
Fast curing, styrene free, acrylic system. Numerous DOT approvals. Available in 10 oz. and 28 oz. cartridges. Browse our selection of anchoring and doweling adhesives for vertical construction and transportation infrastructure. Learn more about cold weather epoxy and...


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