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50-3112
Thermally Conductive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

Hot Melt Adhesives
Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.

20-3302
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

EPO-TEK® 930-4
Thermally Conductive Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

EPO-TEK® H35-175MP
Electrically & Thermally Conductive Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
50-3112
Thermally Conductive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
Hot Melt Adhesives
Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.
20-3302
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
SEALANT CHIP BRUSHES
Available in 2" and 3" sizes
EPO-TEK® 930-4
Thermally Conductive Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® H35-175MP
Electrically & Thermally Conductive Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.


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