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CONVERGENT COLORFAST™ Finish
Clear, Hard Protectant for Stained or Coated Surfaces
COLORFAST™ Finish is a high-performance finish that enhances the appearance and extends the longevity of polished, integrally colored, dyed and stained concrete, providing shine, stain resistance and abrasion resistance. Effective on concrete and cementitious surfaces that are stained...
CONVERGENT Pentra-Sil® (AC)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (AC) is an advanced alkalinity control treatment that reacts with concrete to neutralize its pH levels. Through this permanent reaction, slab sweating and efflorescence is significantly reduced. The lithium silicate in this product also densifies and hardens...
20-2362FR
Potting & Encapsulating
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
20-3305
Potting & Encapsulating
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
EPO-TEK® H20S
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
CONVERGENT COLORFAST™ Finish
Clear, Hard Protectant for Stained or Coated Surfaces
COLORFAST™ Finish is a high-performance finish that enhances the appearance and extends the longevity of polished, integrally colored, dyed and stained concrete, providing shine, stain resistance and abrasion resistance. Effective on concrete and cementitious surfaces that are stained...
CONVERGENT Pentra-Sil® (AC)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (AC) is an advanced alkalinity control treatment that reacts with concrete to neutralize its pH levels. Through this permanent reaction, slab sweating and efflorescence is significantly reduced. The lithium silicate in this product also densifies and hardens...
20-2362FR
Potting & Encapsulating
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
20-3305
Potting & Encapsulating
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
EP-FLEX
Joint Filler
100% solids, semi-rigid, epoxy joint filler.
EPO-TEK® H20S
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
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