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DP 240 / DP 340
Foil Mastic Tape Duct Sealant
A foil backed butyl mastic rolled sealant tape that is fully cured, high pressure/high velocity rated for use on commercial and residential supply and return air ducts. DP Foil Mastic Tape is pressure sensitive and requires no cure...

DP 2595
Closed Cell Foam Spray Adhesive
A premium quality, solvent based, high performance, fast drying, non-flammable, industrial contact insulation adhesive that is water resistant and temperature resistant to 200°F. DP 2595 is formulated for adhering closed cell foam, higher density insulation and applications that...

EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.

EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

DP 1030
Water Based Duct Sealant
A UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1030 allows for easier sealing of holes and gaps often...
DP 240 / DP 340
Foil Mastic Tape Duct Sealant
A foil backed butyl mastic rolled sealant tape that is fully cured, high pressure/high velocity rated for use on commercial and residential supply and return air ducts. DP Foil Mastic Tape is pressure sensitive and requires no cure...
DP 2595
Closed Cell Foam Spray Adhesive
A premium quality, solvent based, high performance, fast drying, non-flammable, industrial contact insulation adhesive that is water resistant and temperature resistant to 200°F. DP 2595 is formulated for adhering closed cell foam, higher density insulation and applications that...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
DP 1030
Water Based Duct Sealant
A UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1030 allows for easier sealing of holes and gaps often...


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