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TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.

EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

ULTRABOND® HS-1CC
High Strength Anchoring Epoxy
NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...

EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

ASF-GEL
Epoxy Gel Acrylic Adhesive
ASF-GEL is a two-component, styrene-free, epoxy acrylate adhesive gel with an extended installation range from 15°F to 95°F.
TRANSIL® 244(+)
Densifying Waterproofer and Chloride Ion Barrier
Transil® 244(+) is a premium Nano-Lithium® hardener, densifier, and hydrophobic sealer ideal for protecting concrete and masonry surfaces against damage from freeze-thaw cycles, moisture, and chloride ion intrusion.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
ULTRABOND® HS-1CC
High Strength Anchoring Epoxy
NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping


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