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EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
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High thermal conductive silver filled adhesive.
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DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...
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Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
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