Related Products

CONVERGENT SlabArmor™ Closer
Colloidal Silica Concrete Densifier/Hardener
SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...

ASI 55
Multi-Purpose Hybrid Sealant and Adhesive
ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...

20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.

HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.
CONVERGENT SlabArmor™ Closer
Colloidal Silica Concrete Densifier/Hardener
SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...
ASI 55
Multi-Purpose Hybrid Sealant and Adhesive
ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.


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