Related Products

Timberline
Moisture-Cured Urethane Adhesive
Timberline is designed to easily install several flooring types including: solid (shorts) and engineered wood, parquet, cork, bamboo (not strand woven) and recycled rubber. This one-part, moisture-cured polyurethane is low VOC and low odor.

U-25
Moisture Barrier & Urethane Soundproofing Adhesive
U-25 is an All-in-One urethane wood flooring adhesive. U-25 is the adhesive, moisture protection and sound control in one easy trowel-on application. U-25 is backed by a Limited Lifetime Warranty.

EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.

2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.
Timberline
Moisture-Cured Urethane Adhesive
Timberline is designed to easily install several flooring types including: solid (shorts) and engineered wood, parquet, cork, bamboo (not strand woven) and recycled rubber. This one-part, moisture-cured polyurethane is low VOC and low odor.
U-25
Moisture Barrier & Urethane Soundproofing Adhesive
U-25 is an All-in-One urethane wood flooring adhesive. U-25 is the adhesive, moisture protection and sound control in one easy trowel-on application. U-25 is backed by a Limited Lifetime Warranty.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.


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