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EPO-TEK® H20E-HC
High Thermal Conductivity Epoxy
High thermal conductivity version of EPO-TEK® H20E.

C-CLEAN100
Concrete Stripper and Cleaner
C-CLEAN100 is a heavy-duty stripper and degreaser that is used for general cleaning and degreasing of concrete surfaces, tools and equipment.

ULTRABOND® 1300-FG
Gel Doweling Adhesive
High-Strength, Fast Gel, Non-Sag Doweling Epoxy

ASI 55
Multi-Purpose Hybrid Sealant and Adhesive
ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
EPO-TEK® H20E-HC
High Thermal Conductivity Epoxy
High thermal conductivity version of EPO-TEK® H20E.
C-CLEAN100
Concrete Stripper and Cleaner
C-CLEAN100 is a heavy-duty stripper and degreaser that is used for general cleaning and degreasing of concrete surfaces, tools and equipment.
ASI 55
Multi-Purpose Hybrid Sealant and Adhesive
ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.


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