EPO-TEK® 320

Features

Black-colored and optically opaque, low viscosity epoxy
Can be used for room temperature curing, low temperature, or box oven elevated temperature cure
Optically opaque between IR and visible regions of light, including 185 - 2500 nm range

Applications

Optical: Blocking light in photonics packaging through VIS and NIR range; sensor packaging including IR detectors packaged in TO-cans; bonding of various optics including lens, prism, diodes; adhesion to metals, most plastics and glasses
Fiber optics: sealing / potting fibers into the boot, ferrule, or fiber feed-through of the package wall

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 320 TDS

File Size 619.3 KB

View

Safety Data Sheet

Document Name EPO-TEK® 320 SDS

File Size 1.0 MB

View

Safety Data Sheet

Document Name EPO-TEK® Syringe SDS

File Size 602.3 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom E-mobility Microelectronics/Semiconductors

Market:

Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Coating Encapsulation Light Blocking Potting Potting and Encapsulation Sealing

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® OE121

Underfill Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

SDS TDS

EPO-TEK® 323LP

Optical Grade Epoxy

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.

TDS

EPO-TEK® HYB-353ND-LV

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

SDS TDS

EPO-TEK® EK1000

Electrically & Thermally Conductive Epoxy

High thermal conductive silver filled adhesive.

TDS

EPO-TEK® OG142-87

UV Curable Epoxy

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.

TDS

EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

SDS TDS