Features
- Long working time
- Low CTE
- Room temperature cure
Applications
- Heat sink bonding
- High thermal conductivity bonding
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High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
20-2362FR
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Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
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Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.


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