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EPO-TEK® 343ND-LH
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Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
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Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
20-2362FR
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Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
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Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
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Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
ASI 388
Electronic Grade RTV Silicone
ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...
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