EPO-TEK® OG142-87

Features

A single component, low viscosity, UV curable epoxy
Adhesive in the active beam path capable of transmitting light in the 400-2000 nm range

Applications

Semiconductor: fill for UV dam and fill encapsulation over ICs and wire bonds. Commonly potted into cavities, epoxy dams, or plastic rings.
Fiber optic: secure fibers into V-grooves; mounting glass cover over fiber arrays
Adheres glass and plastic lens for fiber/lens arrays
Fiber splicing, coupling, and joining. Maintains consistent alignment in active optical pathways
Optics: adheres glass, Lexan, polycarbonate, and many other plastics
Bonds beam splitter cubes and prisms

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OG142-87 TDS

File Size 906.1 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG142-87 SDS

File Size 367.1 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG142-87 Syringe SDS

File Size 367.8 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind

Market:

Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Encapsulation Potting and Encapsulation

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® 377H

Electrically & Thermally Conductive Epoxy

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

TDS

EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

SDS TDS

EPO-TEK® OG116-31

UV Curable Epoxy

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

SDS TDS

60-7111RCL

UV Curable

Non-yellowing UV urethane adhesive and encapsulant.

SDS TDS

EPO-TEK® H20E-MP

Electrically & Thermally Conductive Epoxy

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

TDS