EPO-TEK® OG142-87

Features

A single component, low viscosity, UV curable epoxy
Adhesive in the active beam path capable of transmitting light in the 400-2000 nm range

Applications

Semiconductor: fill for UV dam and fill encapsulation over ICs and wire bonds. Commonly potted into cavities, epoxy dams, or plastic rings.
Fiber optic: secure fibers into V-grooves; mounting glass cover over fiber arrays
Adheres glass and plastic lens for fiber/lens arrays
Fiber splicing, coupling, and joining. Maintains consistent alignment in active optical pathways
Optics: adheres glass, Lexan, polycarbonate, and many other plastics
Bonds beam splitter cubes and prisms

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OG142-87 TDS

File Size 906.1 KB

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Safety Data Sheet

Document Name EPO-TEK® OG142-87 SDS

File Size 367.1 KB

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Safety Data Sheet

Document Name EPO-TEK® OG142-87 Syringe SDS

File Size 367.8 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind

Market:

Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Encapsulation Potting and Encapsulation

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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