EPO-TEK® H20E: Silver Filled Conductive Epoxy

Features

Silver-filled epoxy with a smooth, thixotropic consistency (Thixotropic 4.6)
More than 10kg die shear strength
Meeting NASA E595 low outgassing standard

Applications

Semiconductor IC Packaging (e.g. die attach, flip chip applications, ultrafine pitch SMD printing etc.)
Hybrid Microelectronics (e.g. SMD attach adhesive, EMI and RF shielding of RF, microwave and IR devices etc.)
Solar-Photovoltaic (e.g. common “solar cell stringing” adhesive, chip attached in solar concentrator etc.)
Optoelectronics Packaging ( e.g. die bonds laser diodes for fiber optic components, die-attaching LED chips etc.)

Downloads

Type

Document Name

File Size

Safety Data Sheet

Document Name EPO-TEK® H20E Safety Data Sheet

File Size 1.0 MB

View

Safety Data Sheet

Document Name EPO-TEK® H20E Safety Data Sheet Syringe

File Size 872.2 KB

View

Technical Data Sheet

Document Name EPO-TEK® H20E

File Size 622.5 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind

Market:

Aerospace and Defense Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

Related Products

Viewing options:

EPO-TEK® 730

Thixotropic Epoxy Adhesive

All purpose thixotropic and room temperature-curing epoxy adhesive.

TDS

60-7155RCL

UV Curable Potting Epoxy Resin

Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

SDS TDS

20-3060

Impact Resistant Epoxy

Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.

TDS

EPO-TEK® 353NDP

Hi-Rel Optical Epoxy

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive....

TDS

EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

TDS

ASI 306

Electronic Grade Self-Leveling Silicone

ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

SDS TDS

Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E - Silver Filled Electrically Conductive Epoxy

Features

Applications

Downloads

Certifications